Technical Data ELX1071 Effective July 2021 0603ESDA-MLP1 ESD suppressor Applications ESD port protection for mobile/smart phones Game console ESD port protection High speed ESD data port protection Set-top-boxes Tablets, notebooks, netbooks, laptops High definition television (HDTV) Media players Digital cameras Product features Medical equipment Ultra-low capacitance (0.05 pF) ideal for high Computers and peripherals ESD port protection speed data applications Consumer electronics Provides Electro Static Discharge (ESD) protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 Ordering information Level 4 test Specify part number and packaging suffix Singleline, bi-directional device (e.g. 0603ESDA-MLP1) 0603ESDA-MLP = part 0603 (1608 metric) compact design utilizes number, 1 = form designation) less board space Packaging suffixes 1 (Dip termination, tape and reel, 5000 parts per 7 diameter reel) Environmental compliance PbTechnical Data ELX1071 0603ESDA-MLP1 Effective July 2021 ESD suppressor Product specifications ESD ESD capability capability Rated Attenuation Leakage IEC61000-4- IEC61000-4- voltage Clamping Trigger Capacitance Capacitance change (06 current 2 Direct 2 Air ESD pulse 1 2 3 (V ) voltage voltage 1 MHz (pF) 1 MHz (pF) GHz) (dB) 12 V (nA) discharge discharge withstand dc dc 4 Part number maximum (V) typical (V) typical typical maximum typical typical (kV) typical (kV) typical typical 0603ESDA-MLP1 30 35 300 0.05 0.15 -0.2 <1.0 8.0 15 >1000 1. Clamping voltage: Per IEC61000-4-2, Level 4 waveform (8 kV direct 30 A) measured 30 ns after initial 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. pulse. 4. Part number definition: 0603ESDA-MLP1 2. Trigger voltage: Trigger measurement made using transmission line pulse (TLP) method. 0603ESDA= Product code and size -MLP= Form designation -1= Packaging suffix Dimensionsmm Recommended pad layout Design considerations The location in the circuit for the 0603ESDA-MLP has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a 0-stub pad design (pad directly on the signal/data line and second pad directly on common ground). General specifications Operating temperature: - 55 C to +125 C Storage temperature (component): - 55 C to +125 C Chemical resistance: ASTM D-543 Vibration: MIL-STD-202F method 201A Humidity (steady state): MIL-STD-883, method 1004.7 Thermal shock: MIL-STD-202F method 107G Solderability: MIL-STD-202 Method 208 ESD endurance: IEC 61000-4-2 2 www.eaton.com/electronics