ALPHA TELECORE HF-850 HALOGEN-FREE, HALIDE-FREE, NO-CLEAN, CORED SOLDER WIRE DESCRIPTION ALPHATelecore HF-850 is the fastest wetting and lowest spattering, Halogen Free and Halide Free cored wire offering from ALPHA. It performs admirably when benchmarked against Halogen and Halide containing competitive products available in the market and is a viable option to meet environmental requirements. ALPHA Telecore HF-850s rapid wetting enables its use in drag soldering and minimizes cycle time in robotic and hand soldering applications. Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort are maintained. All this translates to a safe and environmentally compliant product that is operator friendly while maintaining high levels of productivity. FEATURES & BENEFITS Very fast wetting Low Cycle times for component touch-up and manual assembly Very low flux spatter Safe to use, Operator Friendly, Less Residues on Boards Good spread characteristics Excellent First Pass Solder Joints. JIS Spread 80%. Very low levels of fumes Cleaner Working Environment, Less Extraction Maintenance Clear non-tacky residue No-Clean Residues, Useful for all Applications Provides good joint appearance Makes Inspection easy Halogen and Halide Free Environmental compliance and High Electrical Reliability ALPHA Telecore HF-850 is suitable for use in any electronic or industrial no-clean soldering application that specifies compliance to the IPC J-STD-004 ROL0 standard. It is ideal for electronic assemblies used in Automotive, Consumer Electronics, Computer and peripherals, Mobile devices and all types of household appliance applications. PRODUCT INFORMATION Melting or Solidus Standard Alloy Designation Flux Amount / Liquidus Temp C InnoLot** Sn90.85/Ag3.8/Cu0.7/Sb1.5/Ni0.15/Bi3.0 206 - 218 2.2% (High reliability and high operating temperature) J-STD-006B SAC305 217 - 221 1.1%, 2.2% & 3.3% Proprietary SACX Plus 0807 217 - 228 2.2% & 3.3% Proprietary SACX Plus 0307 217 - 228 2.2% & 3.3% Proprietary SnCX Plus 07 227 229 2.2% & 3.3% J-STD-006B Sn99.3/Cu0.7 227 2.2% & 3.3% J-STD-006B Sn63/Pb37 183 1.1%, 2.2% & 3.3% * TELECORE HF-850 may also available in other alloys and flux amounts on request. ** All electronic components used with InnoLot solder alloy must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100C SM 1097-8 2015-12-07 an Alent plc Company ALPHA Global Headquarters 300 Atrium Drive, Somerset, NJ 08873 USA 1-800-367-5460 www.alpha.alent.com The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. ALPHA is a registered trademark of Alpha Metals, Inc. 2014 ALPHA ALPHA TELECORE HF-850 HALOGEN-FREE, HALIDE-FREE, NO-CLEAN, CORED SOLDER WIRE APPLICATION A soldered joint is formed by heating the parts to be soldered to a temperature in excess of the melting point of the alloy to be used in hand soldering this is how a soldering iron is used. By feeding the cored wire onto the parts, the flux is able to flow and remove oxidized metal, while the solder creates a thin inter-metallic bond which becomes the solder joint. Telecore HF-850 is also ideal for robotic soldering applications. Note the following tips: Use a soldering iron tip size and form to suit the operation: small tips for soldering large components may prevent the formation of a joint or slow the process down. Select a solder wire diameter to suit both the soldering iron tip and the parts/components to be soldered. Soldering iron systems should provide sufficient heat to satisfy the requirements of the points above. A typical solder tip temperature would be between 120C and 160C above the liquidus temperature of the alloy. The ideal temperature to use is dependent on how thermally demanding the assembly is. Cored solder wires can be provided in different grades of alloy so always ensures that you have selected the right grade for the application. Do not overheat as this causes an increase in the depth of the inter-metallic layer, which in turn weakens the joint. If you choose to use a liquid rework flux, NR205 No-Clean Low Residue Flux is recommended to maintain high electrical reliability and halogen-free residues. NR205 is available in Alphas Write Flux Pens for precision flux application. HALOGEN STATUS ALPHA TELECORE HF-850 is a Halogen Free product and passes the standards listed in the Table below: Halogen Standards Standard Requirement Test Method Status Post Soldering Residues contain IEC 612249-2-21 < 900 ppm each or total of < 1500 ppm Br Pass or Cl from flame retardant source TM EN 14582 JEDEC Post soldering residues contain A Guideline for DefiningLow Haloge < 1000 ppm Br or Cl from flame retardant Pass Electronics source TECHNICAL DATA Physical Properties Typical Values Rosin Softening Point: 70C 80C Acid Value: 180 - 200 mg KOH/g flux (IPC-TM-650-2.3.13) Halide Content: <500 ppm (IPC-TM-650-2.3.28.1) JIS - 1a3N Grade AA Classification: IPC J-STD-004-ROL0 Chemical Reliability Test Requirements Results Copper Mirror Test (JIS) No complete removal of copper PASS Copper Mirror Test No complete removal of copper PASS (IPC-TM-650- 2.3.32) Copper Corrosion Test (JIS) No evidence of corrosion PASS Copper Corrosion Test No evidence of corrosion PASS IPC-TM-650-2.6.15 SM 1097-8 2015-12-07