CHEMTRONICS TDS CW2200 Technical Data Sheet CircuitWorks Conductive Pen PRODUCT DESCRIPTION TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES CircuitWorks Conductive Pen makes Composition instant highly conductive silver traces on circuit boards. CW2200 is used in Material Silver Filled Polymer prototype, rework, and repair of circuit Silver Particle Size 10-15 microns boards by linking components, repairing Color Silver Gray defective traces, and making smooth Setting Rate <2mm/hr. jumpers. The silver traces dry in minutes Properties and have excellent adhesion to most Conductivity 0.02-0.05 ohms/sq/mil electronic materials. Engineers, repair 0.00005-0.000125 ohm cm technicians, and manufacturers will find that Max. Temperature 400 F (205 C) the CircuitWorks Conductive Pen speeds Tack-Free Time 25 C 3 to 5 Minutes project completion and cuts rework time. Cure Time 25 C 20 to 30 Minutes Solder Wetting 2 to 3 Seconds Single component system Electrical Conductivity Excellent High electrical conductivity Adhesion Excellent Fast drying Flexibility Good Highly adherent to circuit boards Chemical Resistance Good Operating temperature to 400 F (205 C) Tip Diameters MTP 0.8 mm (0.03 inches) STP 1.2 mm (0.05 inches) TYPICAL APPLICATIONS Shelflife 16 months CircuitWorks Conductive Pen may be used for electronics applications including: COMPATIBILITY Circuit Trace Repair CircuitWorks Conductive Pen material has Solderless Linking of Components excellent compatibility with materials used EMI Shielding in printed circuit board fabrication. As with Solderable Terminations any chemical system, compatibility with the Quick Prototype Modifications substrate must be determined on a non- critical area prior to use. Soldering: Low temperature soldering is possible USAGE INSTRUCTIONS to the heat-cured silver conductive traces if done at Read MSDS carefully prior to use. 350F (177C) for <5 seconds. Cleaning: For best adhesion, clean board with one of Chemtronics Electro-Wash or Pow-R-Wash AVAILABILITY solvents in order to remove any surface CW2200STP 8.5 g (0.3 oz.), Standard 1.2 mm tip contamination which may prevent adequate material CW2200MTP 8.5g (0.3 oz.), MicroTip 0.8 mm tip contact. Mixing: Although this system has been formulated TECHNICAL & APPLICATION to resist hard-packing, it should be shaken ASSISTANCE vigorously for 30 seconds to insure the proper Chemtronics provides a technical hotline to answer dispersion of the silver flakes. If pen has been your technical and application related questions. allowed to sit idle for a long period of time, the The toll free number is: 1-800-TECH-401. mixing ball may seize in the barrel. To free the ball use force to tap the barrel end of the pen until the ball begins to move inside the pen. NOTE: Application: The conductive ink is dispensed This information is believed to be accurate. It is through the CircuitWorks Conductive Pen. intended for professional end users having the skills Squeezing the pen body while pressing down on the to evaluate and use the data properly. surface will allow the material to flow, enabling the CHEMTRONICS does not guarantee the accuracy trace to be drawn. Practice with the pen before of the data and assumes no liability in connection attempting detail work. The bulk form of this with damages incurred while using it. material may be applied by brushing, banding, or automatic dispensing equipment. CHEMTRONICS Thinning: The conductive ink has been optimized 8125 COBB CENTER DRIVE for the CircuitWorks Conductive Pen and thinning KENNESAW, GA 30152 is not normally necessary. However, Butyl Acetate 1-770-424-4888 REV. H (01/17) may be added with thorough mixing to make slight adjustments for ease of application in the bulk form. DISTRIBUTED BY: Clean-up/Removal: The conductive ink may be cleaned or removed using a strong organic solvent such as Chemtronics Electro-Wash PX. Curing: Tack-free in 3 to 5 minutes at room temperature. Achieves electrical conductivity within 30 minutes. Heat cure for 5 minutes at 250 to 300 F (120 to 150 C) for maximum conductivity, durability and chemical resistance.