X-On Electronics has gained recognition as a prominent supplier of CONGA-QA3/HSP-B heat sinks across the USA, India, Europe, Australia, and various other global locations. CONGA-QA3/HSP-B heat sinks are a product manufactured by Congatec. We provide cost-effective solutions for heat sinks, ensuring timely deliveries around the world.

conga-QA3/HSP-B Congatec

conga-QA3/HSP-B electronic component of Congatec
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See Product Specifications
Part No.conga-QA3/HSP-B
Manufacturer: Congatec
Category:Heat Sinks
Description: Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm
Datasheet: conga-QA3/HSP-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 22.1812 ea
Line Total: USD 22.18

Availability - 107
Ships to you between
Thu. 13 Jun to Mon. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
55 - WHS 1


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 19.2596
5 : USD 19.1992

     
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RoHS - XON
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We are delighted to provide the CONGA-QA3/HSP-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CONGA-QA3/HSP-B and other electronic components in the Heat Sinks category and beyond.

HIGH PERFORMANCE conga-QA3 rd - 3 Gen. Intel Atom / Celeron processors - High resolution Intel Gen. 7 graphics - Temperature range up to -40C .. +85 Formfactor Qseven Form Factor Rev. 2.0 compliant 70x70 mm CPU Intel Atom E3845 1.91 GHz QuadCore L2 cache 2MB 10W TDP Intel Atom E3827 1.75 GHz Dual Core L2 cache 1MB 8W TDP Intel Atom E3826 1.46 GHz Dual Core L2 cache 1MB 7W TDP Intel Atom E3825 1.33 GHz Dual Core L2 cache 1MB 6W TDP Intel Atom E3815 1.46 GHz Single Core L2 cache 512kB 5W TDP Intel Atom E3805 1.33 GHz Dual Core L2 cache 1MB 3W TDP Intel Celeron J1900 2.0 GHz Quad Core L2 cache 2MB 10W TDP Intel Celeron N2930 1.83 GHz Quad Core L2 cache 2MB 7.5W TDP Intel Celeron N2807 1.58 GHz Dual Core L2 cache 1MB 4.5W TDP DRAM Dual Channel up to 8GB onboard DDR3L with 1333 MT/s Chipset Integrated in SoC Ethernet Intel I210 Gigabit Ethernet controller I/O Interfaces 6x USB 2.0 or 1x USB 3.0 and 5x USB 2.0 2x SATA 1x SDIO 3x PCIe IC Bus LPC bus 1x SPI Mass Storage eMMC 5.0 onboard flash up to 64 GByte (optional only for Intel Atom ) Sound Intel High Definition Audio (Intel HD Audio) Graphics Intel HD Graphics with support for DirectX11 OpenGL 3.0 OpenCL 1.2 OpenGLES 2.0 full HW acceleration for decode/encode of MPEG2, H.264 MVC and dual simultaneous display support LVDS Dual channel LVDS transmitter support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 60Hz Digital Display Interface DisplayPort++ up to 2560x1600 (DDI) Features MIPI-CSI congatec Board controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics IC bus (fast mode 400 kHz multi-master) Power Loss Control Embedded BIOS Features AMI Aptio UEFI 2.x firmware 8 MByte serial SPI with congatec Embedded BIOS features (OEM Logo OEM CMOS Defaults LD Control Display Auto Detection Backlight Control Flash Update) Power Management ACPI 5 .0 compliant Smart Battery Management Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 10 IoT Core Microsoft Windows 8 Microsoft Windows 8 embedded Microsoft Windows 7 Microsoft Windows 7 embedded compact Linux Android Yocto MoonIsland / WindRiver IDP Power Consumption Typ. application 4.5W...12W Temperature Commercial : Operating: 0 to +60C Storage: -20 to +80C Industrial : Operating: -40 to +85C Storage: -45 to +85C Humidity Operating: 10 to 90% r. H. non cond. Storage: 5 to 95% r. H. non cond. Size 70 x 70 mm (2 x 2) www.congatec.comconga-QA3 Block diagram Qseven 2.0 Connector eDP Assembly Option Intel Bay Trail SoC Onboard Channel 1 230 Edge Finger DDR3L Memory DDR3L-1333 MT/s COMPUTE UNIT LVDS/eDP eDP to LVDS eDP LVDS/eDP RES NXP PTN3460 PROCESSOR CORE Tri-gate 3-D 22nm Quad core SoC DDI0 1MB L2 cache shared by 2 cores DP/TMDS Core 1 Core 2 PCIe Port 0 Core 3 Core 4 Onboard PCIe Port 1 Channel 2 SSE4.2 AES AVX DDR3L-1333 MT/s DDR3L Memory PCIe Port 2 PCIe Port 3 SoC TRANSACTION ROUTER PCIe to GBE DISPLAY & GRAPHICS Ethernet Intel l210 Feature MIPI-CSI Interfaces Connector 1x SuperSpeed DisplayPort++ VGA LVDS USB 3.0 Port 0 Multimedia Features 3x USB 2.0 USB 2.0 Port 0..2 MPEG-2 WMV9 SVC SAMU H.264 WMV MVC 3x USB 2.0 USB Hub DivX USB 2.0 Port 3..5 DirectX 11 OpenGL 3.0 OpenGLES 2.0 SATA Port 0 2x SATA 3G OpenCL 1.2 SATA Port 1 HDA I/F INTEGRATED I/O SM Bus Integrated I/O Interfaces 4 bit SD card SATA USB 2.0 USB 3.0 SD/MMC eMMC 4.5 SSD assembly option PCIe LPC Bus GPIOs UART HD Audio SPI PCU SPI Bus SPI Flash CAN Bus LPC LPC Bus Fan Control I2C Bus congatec Board Controller SLP BTN LID BTN TX/RX BC www.congatec.com MEMORY CONTROLLER (1066 or 1333 MT/s) high performance low power X X

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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