X-On Electronics has gained recognition as a prominent supplier of G3R40MT12D mosfet across the USA, India, Europe, Australia, and various other global locations. G3R40MT12D mosfet are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

G3R40MT12D GeneSiC Semiconductor

G3R40MT12D electronic component of GeneSiC Semiconductor
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See Product Specifications
Part No.G3R40MT12D
Manufacturer: GeneSiC Semiconductor
Category:MOSFET
Description: MOSFET 1200V 40mO TO-247-3 G3R SiC MOSFET
Datasheet: G3R40MT12D Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 18.124 ea
Line Total: USD 18.12

Availability - 1856
Ships to you between
Thu. 13 Jun to Mon. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1856 - WHS 1


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 18.124
10 : USD 17.0085
30 : USD 16.399
120 : USD 15.571
270 : USD 15.571
510 : USD 15.571
1020 : USD 15.2375
2520 : USD 14.697

1099 - WHS 2


Ships to you between Fri. 07 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 19.383
3 : USD 18.33
30 : USD 18.135

     
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Hts Code
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TM G3R40MT12D 1200 V 40 m SiC MOSFET Silicon Carbide MOSFET VDS = 1200 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 40 m ID (TC = 100C) = 45 A Features Package D G3R Technology with +15 V Gate Drive Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-3 100% Avalanche (UIL) Tested S = Source REACH Advantages Applications Compatible with Commercial Gate Drivers Solar Inverters Low Conduction Losses at all Temperatures EV/HEV Charging Reduced Ringing Motor Drives Faster and More Efficient Switching High Voltage DC-DC Converters Lesser Switching Spikes and Lower Losses Switched Mode Power Supplies Better Power Density and System Efficiency UPS Ease of Paralleling without Thermal Runaway Smart Grid Transmission and Distribution Superior Robustness and System Reliability Induction Heating and Welding Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1200 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +20 V Gate-Source Voltage (Static) V Recommended Operation -5 / +15 V GS(op) T = 25C, V = -5 / +15 V 63 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +15 V 45 A Fig. 15 TC = 135C, VGS = -5 / +15 V 33 Pulsed Drain Current I t 3s, D 1%, V = 15 V, Note 1 150 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 297 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 2.4 mH, IAS = 17.5 A 374 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.38 0.5 C/W Fig. 13 thJC Weight WT 6.1 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R40MT12D/G3R40MT12D.pdf Page 1 of 14TM G3R40MT12D 1200 V 40 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1200 V DSS GS D Zero Gate Voltage Drain Current I V = 1200 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 20 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 18.0 mA 1.8 2.70 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 18.0 mA, Tj = 175C 2.05 V = 10 V, I = 35 A 16.1 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 35 A, T = 175C 18.1 DS D j V = 15 V, I = 35 A 40 52 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 15 V, I = 35 A, T = 175C 57 GS D j Input Capacitance Ciss 2897 Output Capacitance C 88 pF Fig. 11 oss Reverse Transfer Capacitance C 7.1 rss Coss Stored Energy Eoss 34 J Fig. 12 V = 800 V, V = 0 V DS GS C Stored Charge Q 127 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 106 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 158 Related) Gate-Source Charge Q 29 gs V = 800 V, V = -5 / +15 V DS GS Gate-Drain Charge Q I = 35 A 28 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 88 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 1.2 G(int) AC Turn-On Switching Energy EOn 505 (Body Diode) T = 25C, V = -5/+15V, R = 4 , L = j GS G(ext) J Fig. 22,26 40.0 H, I = 35 A, V = 800 V Turn-Off Switching Energy D DD EOff 97 (Body Diode) Turn-On Delay Time t 45 d(on) V = 800 V, V = -5/+15V DD GS Rise Time tr 16 RG(ext) = 4 , L = 40.0 H, ID = 35 A ns Fig. 24 Turn-Off Delay Time t 19 d(off) Timing relative to V , Inductive load DS Fall Time t 11 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 800V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 800V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R40MT12D/G3R40MT12D.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
GENESIC SEMICONDUCTOR INC.

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