86749 Nickel/Copper Fabric Tape Innovative Innovative TTechnologyechnology for a for a Connected Connected WorldWorld NI/CU POLYESTER CONDUCTIVE FABRIC TAPE Laird Technologies Conductive Fabric Tape 86749 offers exceptional conformability and conductivity for dynamic flex applications. It is constructed of nickel/copper metallized fabric with a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding shielding performance while offering superior abrasion and corrosion resistance under high dynamic flex conditions. The 86749 is a halogen free product and can be supplied in tape or further customized to application by die-cutting or hole punching. FEATURES MARKETS RoHS compliant Cabinet applications Halogen-free per IEC-61249-2-21 standard LCD and Plasma TV Low surface resistivity of < 0.06 / Medical equipment provides excellent conductivity Servers Shielding effectiveness of >62 dB across Printers a wide spectrum of frequencies Laptop computers global solutions: local support TM USA: +1.866.928.8181 Europe: +49.0.8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com86749 Nickel/Copper Fabric Tape Innovative Technology for a Connected World Item Unit Value Test Method Thickness mm 0.060 mm 0.01 - > Peel Adhesion Kgf / 25 mm 0.8 PSTC 101* Shear Adhesion at R.T. Hrs >72 PSTC 107 at 80C Hrs >5 PSTC 107 > Tensile Strength Kgf / 25 mm 7 Operation Temperature C 0-80 < Surface Resistivity (Fabric Side) / 0.06 ASTM F390 Z-axial Resistance <0.04 + Shielding Effectiveness ASTM D4935 at 100 MHz dB 62 at 1GHz dB 68 Package Dimensions M W: Dimension by Customer Spec (Max. Width: 1000 mm) L: Standard Length of 20 M Shelf Life (Under 23C/65% R.H.) Six Months *:Test Method A, dwell time 30 min. :Contact area 25 mm by 25 mm +:Typical value COMPOSITION OF PRODUCT Conductive layer (metallized fabric) Adhesive layer (acrylic conductive pressure sensitive adhesive) Release paper APPLICATION TECHNIQUES 1. Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesive contact & thus improves bond strength. 2. To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. A typical surface cleaning solvent is isopropyl alcohol. Use proper safety precautions for handling solvents. 3. Ideal tape application temperature range is 21C to 38C. Initial tape application to surfaces at temperatures below 10C is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory. EMI-DS-FOF-86749 1112 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.