SMT3-01-Z Nidec Copal

SMT3/SMTE3 Surface Mount Tactile Switches Washable RoHS Compliant Features Specications Max. 0.6VA max.24VDC max. 30mA max. 1. Compatible With Lead-Free, Reow Soldering Rating Silver plated contacts 1mA 5VDC Heat-resistance resin for lead-free soldering. Min. Gold plated contacts 10 A 5VDC 2. Washable (SMTE3 Series) Initial contact resistance 100m max. 1.5mA 200 VAC 3. J-Lead Terminal Pins For High-Density Mounting Dielectric strength 250VAC 1 minute 4. Anti-Static Electricity (SMTE3 Series) Insulation resistance 100M min. 100VDC Ground terminal is provided to prevent damage to element Electrostatic capacity 5pF max. caused by static electricity. Electrical life 100,000 operations SMT3 0.25mm Stroke SMTE3 0.5mm SMT3 1.18 0.39 N Operating force SMTE3 1.96 0.98 N 25 70 Operating temperature range 40 85 Storage temperature range Part Numbering Structure SMT E G 3 01 E Z Series code Structure Contact plating Series No. Registration No. Packaging specs. Standard type None (Plastic button) None None Silver plated Stick Immersion washable E (Rubber button) Gold plated Emboss taping G E Table of Part Numbers Pad Layouts Top view Packaging specications Ground terminals Without With Structure Stick Emboss taping SMT3SMTE3 SMTE3 Part No. SMTG3SMTEG3 SMTEG3 SMT3-01E-Z Standard type SMT3-01-Z SMTG3-01E-Z SMTE3-01-Z SMTE3-01E-Z Pattern dimensions Immersion washable SMTEG3-01-Z SMTEG3-01E-Z Made to order products. SMT3 SPST Switchng function Part No. SMT3 SMT3-01-Z SMT3-01E-Z SMTG3-01E-Z SMTE3-01-Z OFF ON SMTE3-01E-Z SMTEG3-01-Z SMTEG3-01E-Z 13 Connecting terminals - - 24 SMTE3 Washable Circuit diagrams ONMomentary EGGround terminal (SMTE3 and SMTEG3 series) Terminal numbers are not shown on the switch. Soldering Specications Flux Cleaning 1 Manual Soldering Since the SMT3 series is not process sealed, be sure to Device : Soldering iron use low-residue ux. 350 C 10 C 3 0.5 seconds 1 Solvent: Fluorine or Alcohol type 2 Reow Soldering Cleaning with other solvents or water is not possible. Device : Inline or batch system 2 Cleaning after soldering should be done after the terminal temperature falls to 90 C or below, or after leaving the switch for ve minutes or longer at room temperature. Cleaning temperature: 43 C, max. 3 Do not use ultrasonic cleaning. Apply reow soldering up to 2 times max. Packaging Specications Stick Emboss taping When ordering, tape packaged version shall be supplied by request. Minimum packaging quantity for reel packaging is 1,000pcs per reel. ON Momentary