74LVC1G17GM NXP

74LVC1G17 Single Schmitt trigger buffer Rev. 12 8 June 2018 Product data sheet 1 General description The 74LVC1G17 provides a buffer function with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined outputs. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using I . The I OFF OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2 Features and benefits Wide supply voltage range from 1.65 V to 5.5 V High noise immunity Complies with JEDEC standard JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8B/JESD36 (2.7 V to 3.6 V) ESD protection: HBM: ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2000 V MM: JESD22-A115-A exceeds 200 V 24 mA output drive (V = 3.0 V) CC CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Unlimited rise and fall times Inputs accept voltages up to 5 V Multiple package options Specified from -40 C to +85 C and from -40 C to +125 C 3 Ordering information Table 1.Ordering information Type number Package Temperature range Name Description Version 74LVC1G17GW -40 C to +125 C TSSOP5 plastic thin shrink small outline package; SOT353-1 5 leads; body width 1.25 mm 74LVC1G17GV -40 C to +125 C SC-74A plastic surface-mounted package; 5 leads SOT753Nexperia 74LVC1G17 Single Schmitt trigger buffer Type number Package Temperature range Name Description Version 74LVC1G17GM -40 C to +125 C XSON6 plastic extremely thin small outline package; SOT886 no leads; 6 terminals; body 1 x 1.45 x 0.5 mm 74LVC1G17GF -40 C to +125 C XSON6 plastic extremely thin small outline package; SOT891 no leads; 6 terminals; body 1 x 1 x 0.5 mm 74LVC1G17GN -40 C to +125 C XSON6 extremely thin small outline package; no leads; SOT1115 6 terminals; body 0.9 x 1.0 x 0.35 mm 74LVC1G17GS -40 C to +125 C XSON6 extremely thin small outline package; no leads; SOT1202 6 terminals; body 1.0 x 1.0 x 0.35 mm 74LVC1G17GX -40 C to +125 C X2SON5 plastic thermal enhanced extremely thin SOT1226 small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm 74LVC1G17GX4 -40 C to +125 C X2SON4 plastic thermal enhanced extremely thin SOT1269-2 small outline package; no leads; 4 terminals; body 0.6 x 0.6 x 0.32 mm 4 Marking Table 2.Marking codes [1] Type number Marking 74LVC1G17GW VJ 74LVC1G17GV V17 74LVC1G17GM VJ 74LVC1G17GF VJ 74LVC1G17GN VJ 74LVC1G17GS VJ 74LVC1G17GX VJ 74LVC1G17GX4 VJ [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5 Functional diagram A Y mnb150 mnb151 Figure 1. Logic symbol Figure 2. IEC logic symbol A Y mnb152 Figure 3. Logic diagram 74LVC1G17 All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2018. All rights reserved. Product data sheet Rev. 12 8 June 2018 2 / 22