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T1042NSE7PQB

T1042NSE7PQB electronic component of NXP
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Part No.T1042NSE7PQB
Manufacturer: NXP
Category:Processors - Application Specialised
Description: Processors - Application Specialised QorIQ, 4x e5500, 1400MHz, DDR3L/4, W/ Crypto, No Switch, 0 to 105
Datasheet: T1042NSE7PQB Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 168.1645 ea
Line Total: USD 168.16

Availability - 58
Ships to you between
Wed. 05 Jun to Fri. 07 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
23 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 60
Multiples : 24
60 : USD 163.1707

58 - WHS 2


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 1
Multiples : 1
1 : USD 168.1645
10 : USD 140.5645
120 : USD 140.5645
300 : USD 140.5645
540 : USD 140.5645
1020 : USD 140.5645
2520 : USD 140.5645
5040 : USD 140.5645
10020 : USD 140.5645

     
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Document Number T1042 Freescale Semiconductor Rev. 2, 06/2015 Data Sheet: Technical Data T1042 QorIQ T1042, T1022 Data Sheet Features Additional peripheral interfaces Two high-speed USB 2.0 controllers with integrated e5500 cores built on Power Architecture technology, PHY T1042 has four cores and T1022 has two cores Enhanced secure digital host controller with support Each core with a private 256KB L2 cache for high capacity memory card(SD/eSDHC/eMMC) 256 KB shared L3 CoreNet platform cache (CPC) Enhanced Serial peripheral interface (eSPI) Four I2C controllers Hierarchical interconnect fabric Two DUARTs CoreNet Coherency manager supporting coherent Integrated flash controller supporting NAND and and non-coherent transactions with prioritization and NOR flash bandwidth allocation amongst CoreNet end-points Display interface unit (DIU) with 12-bit dual data 150Gbps coherent read bandwidth rate One 32-/64-bit DDR3L/DDR4 SDRAM memory TDM Interface controllers Four GPIO controllers supporting up to 109 general ECC and interleaving support purpose I/O signals Two 8-channel DMA engines Data Path Acceleration Architecture (DPAA) Multicore programmable interrupt controller (MPIC) incorporating acceleration for the following functions: Packet parsing, classification, and distribution QUICC Engine block Queue management for scheduling, packet 32-bit RISC controller for flexible support of the sequencing, and congestion management communications peripherals Hardware buffer management for buffer allocation Serial DMA channel for receive and transmit on all and de-allocation serial channels Cryptography Acceleration Two universal communication controllers, RegEx Pattern Matching Acceleration supporting TDM, HDLC and UART IEEE Std 1588 support 780 FC-PBGA package, 23 mm x 23 mm Parallel Ethernet interfaces Up to two RGMII interface One MII interface Eight SerDes lanes for high-speed peripheral interfaces Four PCI Express 2.0 controllers Two Serial ATA (SATA 3Gb/s) controllers Up to five SGMII interface supporting 1000 Mbps Up to two SGMII interface with maximum speed of 2500 Mbps Supports 1000Base-KX 2015 Freescale Semiconductor, Inc.Table of Contents 1 Overview.............................................................................................. 3 3.18 I2C interface.............................................................................. 127 2 Pin assignments.................................................................................... 4 3.19 GPIO interface...........................................................................131 2.1 780 ball layout diagrams........................................................... 4 3.20 Display interface unit................................................................ 133 2.2 Pinout list...................................................................................10 3.21 TDM interface........................................................................... 135 3 Electrical characteristics.......................................................................46 3.22 High-speed serial interfaces (HSSI).......................................... 137 3.1 Overall DC electrical characteristics.........................................46 4 Hardware design considerations...........................................................160 3.2 Power sequencing......................................................................53 4.1 System clocking........................................................................ 160 3.3 Power-down requirements.........................................................56 4.2 Power supply design..................................................................170 3.4 Power-on ramp rate................................................................... 57 4.3 Decoupling recommendations...................................................175 3.5 Power characteristics.................................................................57 4.4 SerDes block power supply decoupling recommendations.......175 3.6 Input clocks............................................................................... 61 4.5 Connection recommendations................................................... 176 3.7 RESET initialization..................................................................67 4.6 Thermal......................................................................................187 3.8 DDR4 and DDR3L SDRAM controller.................................... 68 4.7 Recommended thermal model...................................................188 3.9 eSPI interface.............................................................................75 4.8 Temperature diode.....................................................................188 3.10 DUART interface...................................................................... 78 4.9 Thermal management information............................................ 189 3.11 Ethernet interface, Ethernet management interface, IEEE Std 5 Package information.............................................................................192 1588........................................................................................... 80 5.1 Package parameters for the FC-PBGA......................................192 3.12 QUICC Engine Specifications...................................................99 5.2 Mechanical dimensions of the FC-PBGA................................. 192 3.13 USB interface............................................................................ 104 6 Security fuse processor.........................................................................194 3.14 Integrated flash controller..........................................................105 7 Ordering information............................................................................194 3.15 Enhanced secure digital host controller (eSDHC).....................113 7.1 Part numbering nomenclature....................................................194 3.16 Multicore programmable interrupt controller (MPIC).............. 122 7.2 Part marking.............................................................................. 195 3.17 JTAG controller.........................................................................124 8 Revision history....................................................................................196 QorIQ T1042, T1022 Data Sheet, Rev. 2, 06/2015 2 Freescale Semiconductor, Inc.

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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