X-On Electronics has gained recognition as a prominent supplier of W632GU6NB11I TR dram across the USA, India, Europe, Australia, and various other global locations. W632GU6NB11I TR dram are a product manufactured by Winbond. We provide cost-effective solutions for dram, ensuring timely deliveries around the world.

W632GU6NB11I TR Winbond

W632GU6NB11I TR electronic component of Winbond
Images are for reference only
See Product Specifications
Part No.W632GU6NB11I TR
Manufacturer: Winbond
Category:DRAM
Description: DRAM 2Gb DDR3L 1.35V SDRAM, x16, Industrial Temp. 933MHz T&R
Datasheet: W632GU6NB11I TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 5.8614 ea
Line Total: USD 5.86

Availability - 2861
Ships to you between
Thu. 13 Jun to Mon. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2861 - WHS 1


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 5.7615
10 : USD 5.2555
100 : USD 4.7725
250 : USD 4.761
500 : USD 4.554
1000 : USD 4.416
3000 : USD 4.1515

     
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Access Time
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Part-Description
Stock Image W9712G6KB25I
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9825G6KH-6
IC SDRAM 256MBIT 166MHZ 54TSOP
Stock : 1745
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9712G6KB-25
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9425G6KH-5
4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 1675
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5I
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 284
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 1727
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9864G6KH-6
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
Stock : 2463
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9816G6JH-7
DRAM 16M SDR SDRAM 133MHz
Stock : 685
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W956D8MBKX5I
DRAM 64Mb HyperRAM x8 200MHz Ind temp 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G8NB-25
DRAM 512Mb DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image M366S0924FTS-C7A00
DRAM Module SDRAM 64Mbyte 168UDIMM Tray
Stock : 62
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT47H128M4CB-37E
DRAM Chip DDR2 SDRAM 512M-Bit 128Mx4 1.8V 60-Pin FBGA Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image K4S560432C-TC75
DRAM Chip SDRAM 256M-Bit 64Mx4 3.3V 54-Pin TSOP-II
Stock : 299
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image K4S641632H-UC60
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II T/R
Stock : 5493
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image KM44C4100CK-6
DRAM Chip FPM 16M-Bit 4Mx4 5V 24-Pin SOJ
Stock : 706
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT46V32M8TG-5B/G
DRAM Chip DDR SDRAM 256Mbit 32Mx8 2.6V 66-Pin TSOP Tray
Stock : 147
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT46V64M4TG-6
DRAM Chip DDR SDRAM 256M-Bit 64Mx4 2.5V 66-Pin TSOP Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S27KS0641DPBHA020
DRAM Nor
Stock : 9
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image IS42S16100H-7BLI-TR
DRAM 16M, 3.3V, SDRAM 1Mx16, 143Mhz,RoHS
Stock : 6312
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image NTE2117
DRAM Chip DRAM 16K-Bit 16Kx1 5V 16-Pin DIP
Stock : 3
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
We are delighted to provide the W632GU6NB11I TR from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W632GU6NB11I TR and other electronic components in the DRAM category and beyond.

W632GU6NB 16M 8 BANKS 16 BIT DDR3L SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 5 2. FEATURES ........................................................................................................................................... 5 3. ORDER INFORMATION ....................................................................................................................... 6 4. KEY PARAMETERS ............................................................................................................................. 7 5. BALL CONFIGURATION ...................................................................................................................... 9 6. BALL DESCRIPTION .......................................................................................................................... 10 7. BLOCK DIAGRAM .............................................................................................................................. 12 8. FUNCTIONAL DESCRIPTION ............................................................................................................ 13 8.1 Basic Functionality .............................................................................................................................. 13 8.2 RESET and Initialization Procedure .................................................................................................... 13 8.2.1 Power-up Initialization Sequence ..................................................................................... 13 8.2.2 Reset Initialization with Stable Power .............................................................................. 15 8.3 Programming the Mode Registers ....................................................................................................... 16 8.3.1 Mode Register MR0 ......................................................................................................... 18 8.3.1.1 Burst Length, Type and Order ................................................................................ 19 8.3.1.2 CAS Latency........................................................................................................... 19 8.3.1.3 Test Mode............................................................................................................... 20 8.3.1.4 DLL Reset............................................................................................................... 20 8.3.1.5 Write Recovery ....................................................................................................... 20 8.3.1.6 Precharge PD DLL ................................................................................................. 20 8.3.2 Mode Register MR1 ......................................................................................................... 21 8.3.2.1 DLL Enable/Disable ................................................................................................ 21 8.3.2.2 Output Driver Impedance Control ........................................................................... 22 8.3.2.3 ODT RTT Values .................................................................................................... 22 8.3.2.4 Additive Latency (AL) ............................................................................................. 22 8.3.2.5 Write leveling .......................................................................................................... 22 8.3.2.6 Output Disable ........................................................................................................ 22 8.3.3 Mode Register MR2 ......................................................................................................... 23 8.3.3.1 Partial Array Self Refresh (PASR) .......................................................................... 24 8.3.3.2 CAS Write Latency (CWL) ...................................................................................... 24 8.3.3.3 Auto Self Refresh (ASR) and Self Refresh Temperature (SRT) ............................. 24 8.3.3.4 Dynamic ODT (Rtt WR) ......................................................................................... 24 8.3.4 Mode Register MR3 ......................................................................................................... 25 8.3.4.1 Multi Purpose Register (MPR) ................................................................................ 25 8.4 No OPeration (NOP) Command .......................................................................................................... 26 8.5 Deselect Command ............................................................................................................................. 26 8.6 DLL-off Mode ...................................................................................................................................... 26 8.7 DLL on/off switching procedure ........................................................................................................... 27 8.7.1 DLL on to DLL off Procedure ....................................................................................... 27 8.7.2 DLL off to DLL on Procedure ....................................................................................... 28 8.8 Input clock frequency change ............................................................................................................. 29 8.8.1 Frequency change during Self-Refresh............................................................................ 29 8.8.2 Frequency change during Precharge Power-down .......................................................... 29 8.9 Write Leveling ..................................................................................................................................... 31 8.9.1 DRAM setting for write leveling & DRAM termination function in that mode .................... 32 Publication Release Date: Apr. 10, 2019 Revision: A02 - 1 - W632GU6NB 8.9.2 Write Leveling Procedure ................................................................................................. 32 8.9.3 Write Leveling Mode Exit ................................................................................................. 34 8.10 Multi Purpose Register ........................................................................................................................ 35 8.10.1 MPR Functional Description ............................................................................................. 36 8.10.2 MPR Register Address Definition ..................................................................................... 37 8.10.3 Relevant Timing Parameters ............................................................................................ 37 8.10.4 Protocol Example ............................................................................................................. 37 8.11 ACTIVE Command .............................................................................................................................. 43 8.12 PRECHARGE Command .................................................................................................................... 43 8.13 READ Operation ................................................................................................................................. 44 8.13.1 READ Burst Operation ..................................................................................................... 44 8.13.2 READ Timing Definitions .................................................................................................. 45 8.13.2.1 READ Timing Clock to Data Strobe relationship .................................................... 46 8.13.2.2 READ Timing Data Strobe to Data relationship ..................................................... 47 8.13.2.3 tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Calculation ............................................. 48 8.13.2.4 tRPRE Calculation .................................................................................................. 49 8.13.2.5 tRPST Calculation .................................................................................................. 49 8.13.2.6 Burst Read Operation followed by a Precharge...................................................... 55 8.14 WRITE Operation ................................................................................................................................ 57 8.14.1 DDR3L Burst Operation ................................................................................................... 57 8.14.2 WRITE Timing Violations ................................................................................................. 57 8.14.2.1 Motivation ............................................................................................................... 57 8.14.2.2 Data Setup and Hold Violations .............................................................................. 57 8.14.2.3 Strobe to Strobe and Strobe to Clock Violations ..................................................... 57 8.14.2.4 Write Timing Parameters ........................................................................................ 57 8.14.3 Write Data Mask............................................................................................................... 58 8.14.4 tWPRE Calculation........................................................................................................... 59 8.14.5 tWPST Calculation ........................................................................................................... 59 8.15 Refresh Command .............................................................................................................................. 66 8.16 Self-Refresh Operation ....................................................................................................................... 68 8.17 Power-Down Modes ............................................................................................................................ 70 8.17.1 Power-Down Entry and Exit ............................................................................................. 70 8.17.2 Power-Down clarifications - Case 1 ................................................................................. 76 8.17.3 Power-Down clarifications - Case 2 ................................................................................. 76 8.17.4 Power-Down clarifications - Case 3 ................................................................................. 77 8.18 ZQ Calibration Commands .................................................................................................................. 78 8.18.1 ZQ Calibration Description ............................................................................................... 78 8.18.2 ZQ Calibration Timing ...................................................................................................... 79 8.18.3 ZQ External Resistor Value, Tolerance, and Capacitive loading ...................................... 79 8.19 On-Die Termination (ODT) .................................................................................................................. 80 8.19.1 ODT Mode Register and ODT Truth Table ...................................................................... 80 8.19.2 Synchronous ODT Mode .................................................................................................. 81 8.19.2.1 ODT Latency and Posted ODT ............................................................................... 81 8.19.2.2 Timing Parameters ................................................................................................. 81 8.19.2.3 ODT during Reads .................................................................................................. 83 8.19.3 Dynamic ODT .................................................................................................................. 84 8.19.3.1 Functional Description: ........................................................................................... 84 8.19.3.2 ODT Timing Diagrams ............................................................................................ 85 8.19.4 Asynchronous ODT Mode ................................................................................................ 89 Publication Release Date: Apr. 10, 2019 Revision: A02 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted